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Our modern facility is equipped with the most up-to-date manufacturing and test equipment to thoroughly build, test, and screen your high performance devices quickly and efficiently. Automated Assembly Our automated assembly lines offer highly accurate, repeatable chip placement and bonding with minimal tooling and setup times. We provide fully automated chip and wire assembly using MRSI 170/505 epoxy dispense and component placement systems, and Palomar 2460 III and Palomar 2470 IV wire bonders. This automated assembly line is capable of producing in excess of 3,000 MMIC based modules per month. Automated Test At LNX, test data capture is automated for greater efficiency. LNX test equipment programming and data manipulation are performed using LabView and MATLAB software tools. In addition to offering precise analysis, our modular programming approach leads to shorter set up times and reduced test costs. Build-to-print services LNX offers build-to-print services of your designs on our automated assembly lines. We are experienced in both material sourcing and the handling of CFE kits. Our build-to-print expertise includes: single function RF microwave, and millimeter wave components, such as gain blocks, switching modules, frequency translation devices, as well as the most complex subsystem assemblies, such as transceivers, block converters, switch matrices, and switch filter/ amplifier banks. Electrical test and environmental stress screening are also available to meet the needs of your production requirements. In-house Environmental Capabilities
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